THR - Through Hole Reflow COMBICON - Male Connectors for the Reflow Process

This section provides information about using and processing THR connectors. There are numerous abbreviations and terms associated with Through Hole Reflow. Of the terms given here, Pin-in-Paste was generally the first term to be associated with Through Hole Reflow. All other terms used in the market refer to the same method.

However, the conventional push-through component (THT) is now being optimized to create a push- through component for reflow processes.

This is why Phoenix Contact opted for the expression "Through Hole Reflow", which links the concept of push-through components with reflow capabilities. A typical example of modern printed circuit boards. SMD components often account for a very high proportion of approximately 80% compared to conventionally wired components, which only account for approximately 20%. However, a very important factor is that this 20% share accounts for 40% of the total costs. Therefore methods need to be found to reduce these costs.

THR components and SMD components should be processed at the same time using the same equipment, the same method, and under the same conditions. The parameters that are to be observed when processing the components are given in the relevant section.